First, SMT process ------ single-sided assembly process

Incoming material inspection --> Screen printing solder paste (point patch adhesive) --> patch --> drying (curing ) --> reflow soldering --> cleaning --> inspection --> repair

Second, SMT process ------ single-sided mixing process

Incoming material inspection --> PCB A side silk screen solder paste (point patch glue) --> patch --> drying (curing) --> reflow soldering --> cleaning --> plug --> wave soldering --> Cleaning --> Inspection --> Rework

Third, SMT process ------ double-sided assembly process

A: incoming material inspection --> PCB A side silk screen solder paste (point patch glue) --> patch --> drying (curing) --> A surface reflow soldering --> cleaning --> flap --> PCB B-side silk screen solder paste (point paste glue) --> Patch --> Drying --> reflow soldering (preferably only for B side --> cleaning --> detection --> repair This process is suitable for use when a large SMD such as PLCC is attached to both sides of the PCB.

B: Incoming material inspection --> PCB A-side silk screen solder paste (point patch glue) --> Patch --> Drying (curing) --> A surface reflow soldering --> Cleaning --> Flip --> PCB B-side patch adhesive --> Patch --> Curing --> B-face wave soldering --> Cleaning --> Inspection --> Rework ) This process is suitable for PCB A surface reflow Welding, B-side wave soldering.

This process should be used in SMDs assembled on the B side of the PCB only when the SOT or SOIC (28) pins are below.

Fourth, SMT process ------ double-sided mixing process

A: incoming inspection --> PCB B-side patch adhesive --> patch --> curing --> flap --> PCB A side plug --> wave solder --> cleaning --> Detection --> Rework and post-insertion, suitable for SMD components more than separate components

B: incoming material inspection --> PCB A side plug-in (pin bending) --> flap --> PCB B-side point patch glue --> patch --> curing --> flap - -> Wave soldering --> cleaning --> inspection --> repair

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